1. Feng Chia University Institutional Repository

瀏覽 的方式： 作者 鄭仙志

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題名作者日期
Characterization of Thermal-Electric Performance of Silicon Power MOSFET Inverter Using Coupled Field Analysis鄭仙志04-17-19
Process-induced Warpage Characterization of Flip Chip Package on Packaging鄭仙志11-13-19
Theoretical and Experimental Prediction of Switching Loss of Power MOSFET鄭仙志10-23-19
Viscoelastic Effects on Process-induced Warpage of Fan-out Wafer-level Package during Molding Process鄭仙志10-23-19
扇出型晶圓級構裝於模壓製程之晶片偏移討論鄭仙志11-29-19
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